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Home | Testing and Programming | Internal Visual and Mechanical Inspection
Internal Visual and Mechanical Inspection(MIL-STD-883G, Method 2014)
This is a destructive test which device will be de-capsulated by sophisticated equipment in order to observe the internal wafer and chip set. This procedure allows to inspect the part internally. In most cases engineers would be able to notice the device internal conditions and also manufactures logo or part number marked on the wafer which proves the origin of the device.
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