Link To Electro-Comp Home Page GET A QUOTE | CONTACT US | 727.532.4262
HOME | ELECTRONIC SERVICES | FACILITIES | QUALITY CONTROL | LINE CARD | ABOUT ELECTRO-COMP |
Home | Testing and Programming | Radiography Analysis

Radiography Analysis

(MIL-STD-883G, Method 2012.7)

This procedure is nondestructive and it detects defects within the sealed case, especially those resulting from the sealing process and internal defects such as foreign objects, improper interconnecting wires, and voids in the die attach material or in the glass when glass seals are used.


© Electro-Comp Services, Inc.

Link to AMD Link to Analog Devices Link to Motorola US Link to National Semiconductor Link to Samsung US Link to Texas Instruments US Link to Vishay Manufacturers Link to Xilinx

Site Map | Terms | Tape and Reel Services | Testing and Programming | Component Distribution | Tinning | MSL Baking | Contact

ELECTRO-COMP SERVICES, INC. © 2009 | 3634 131st Ave North Clearwater, FL 33762 | PHONE: 727.532.4262 | FAX: 727.532.4122

Website Design: Coolfish Web Design