Solderability Testing
(JEDEC J-STD-002B)

This evaluation is made to verify the solderability of component leads and terminations meet the requirements established in the standard J-STD-002B and that following storage has had no adverse effect on the ability to solder components to an interconnecting substrate. This test can be performed using two methods: Steam Aging and Bake Method. The major difference between the two methods is Steam Aging is a destructive test and Bake Method is nondestructive.